New yellow flexible PCB pcb circuit boards customized electronic rigid-flex

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Specification MOQ1 PIECE Quick Proofing

Ilość

.New Product!Model Number:flexible box mod assembly service
Type:FPC
Place of Guangdong,
turnkey service fpc box assembly
Base Material:PI
Copper Thickness:12um--70um
Board Thickness:0.1-6.0
Min. Hole Size:0.1mm
Min. Line Width:0.05mm
Min. Line Spacing:0.05
Surface Finishing:osp,ENIG,immersion Tin
Board Size:1200*1200mm
Product name:Printed Circuit Board
Service:One-stop OEM Service
Item:Flexible Pcb Prototype
Keyword:PCB Circuit Board
Solder mask color:Green Solder Mask
Other Service:Components
Name:PCB Board Production
FPC Service:One-top Service
Silkscreen Color:Black.white.yellow.red.blue
Solder mask:Green.Black.Red.Yellow.White.Blue

Video Description

Company Information

Company introduction

King Field has the capability to manufacture pcb ranging from basic single sided boards up to forty layers, and provide one stop turnkey services, including pcb manufacture, assembly, components sourcing and function testing.With one-stop solution, high-end product structure, professional product development and manufacturing technology, stable quality performance and well management system,

King Field has established long-term and stable cooperate relations with the world's leading communication equipment , aerospace electronics and medical equipment manufacturers.

Details Images

RPCB　Main Equipment

FPCB Manufacturing Capability
Item	Production capability
Layer Count	1～6
Production size(Min & Max)	250mm×40mm / 710mm×250mm
Copper thickness of lamination	1/3 ～ 1oz
Product board thickness	0.036 ～ 2.5mm
Auto-cutting accuracy	±0.1mm
Drill size(Min/Max/hole size tolerance)	0.075mm/ 6.5mm / ±0.025mm
Min percent for CNC slot length and width	2:01:00
maximum aspect Ratio (thickness/hole diameter)	8:01
Homogeneity of Plating Cu	≥90%
Accuracy of pattern to pattern	±3mil ( ±0.075mm)
Accuracy of pattern to hole	±4mil ( ±0.1mm )
Min line width/space	0.045 /0.045
Etching tolerance	±20％(±0.02mm)
Cover layer alignment tolerance	±6mil (±0.1 mm)
Excessive adhesive tolerance for pressing C/L	0.1mm
Alignment tolerance for thermosetting S/M and UV S/M	±0.3mm
Min S/M bridge	0.1mm
Min space for S/M to pad, to SMT	0.075mm / 0. 1mm
Min space for legend to pad/ to SMT	0.2mm / 0.2mm
Surface treatment thickness for Ni/Au/Sn/OSP	1～6um /0.05～0.76um /4～20um/ 1um
Min size E- tested pad	8 X 8mil
Min space between tested pads	8mil
Min dimention tolerance of outline (outside edge to circuit)	±0.1mm
Min dimention tolerance of outline	±0.1mm
Min R corner radius of outline (Inner filleted corner)	0.2mm
Min space golden finger to outline	0.075mm