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New design development custom PCBA development 4G lte motherboard Android p

New design development custom PCBA development 4G lte motherboard Android p

gtooza.com

Обычная цена $3.63 USD
Обычная цена $6.17 USD Цена со скидкой $3.63 USD
Распродажа Продано
Specification
.New Product!Model Number:1.6MM 2R +1F Rigid-Flex Board
Type:PCB
Place of Guangdong,
King Field
Supplier Type:pcba one step services, OEM ODM
Copper Thickness:1-5oz
Product name:PCBA Board Assembly
Service:One-stop Turnkey PCBA Service
Application:Electronics Device
Certificate:ISO9001/Iso14001/CE/ROHS
Solder mask color:Black.Red.Yellow.White.Blue.Green
Solder mask:White Black Green Blue Red
Testing Service:AOI X-Ray Function Test
PCBA service:SMT Assembly
Keywords:PCBA OEM PCB Assembly








Video Description


















Company introduction electronics PCBA factory


King Field has the capability to manufacture pcb ranging from basic single sided boards up to forty layers, and provide one stop turnkey services, including pcb manufacture, assembly, components sourcing and function testing.With one-stop solution, high-end product structure, professional product development and manufacturing technology, stable quality performance and well management system,

King Field has established long-term and stable cooperate relations with the world's leading communication equipment , aerospace electronics and medical equipment manufacturers.custom PCBA development 4G lte motherboard Android prototype Model KC2 with Ethernet GPIOGPS PCB SMT







Details Images





























































SMT Manufacturing Capability


























































































































































































SMT Manufacturing Capability







Item







Manufacturing Capability in process




Manufacturing Method




Production size(Min/Max)





50×50mm / 500×500mm










Production board thickness





0.2 ~ 4mm






























Printing solder paste



Support method









Magnetism fixture, vacuo platform











Clamping method









Sticking up by vacuo, clamping on both sides ,flexible clamping with sheet, flexible clamping with thick board




Cleaning Method of printing solder paste









Dry method+ wetting method+ Vacuo method




Accuracy of printing



±0.025mm










SPI



Repeated accuracy of volume



<1% at 3σ


















Mounting component



Components size



0603(Option) L75mm Connector










Pitch



0.15mm










Repeated accuracy



±0.01mm














AOI



FOV size



61×45mm










Test speed



9150mm²/Sec










3D X-ray



Shootingangle



0-45




















































































































.Hot Product!
.By Hong Kong Yuanfeng Intermational Technology Industry.
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